Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Cement-Bonded Board Industry and Market in Japan and New Technology Developments
Cement-Bonded Board Industry and Market in Japan and New Technology Developments
Cement-Bonded Board Industry and Market in Japan and New Technology Developments
Kuroki, Y. (Autor:in) / Nagadomi, W. (Autor:in) / Sasaki, H. (Autor:in) / Kawai, S. (Autor:in) / Moslemi, A. A.
4th International conference, Inorganic-bonded wood and fiber composite materials ; 1994 ; Spokane; WA
01.01.1995
8 pages
Aufsatz (Konferenz)
Englisch
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