Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Thermal Analysis of Cement-Bonded Particleboards
Thermal Analysis of Cement-Bonded Particleboards
Thermal Analysis of Cement-Bonded Particleboards
Alpar, T. (Autor:in) / Nemeth, K. (Autor:in) / Takats, P. (Autor:in) / Winkler, A. (Autor:in) / Moslemi, A. A.
Conference; 5th, Inorganic-bonded wood and fiber composite materials ; 1996 ; Spokane; WA [date and venue unconfirmed]
01.01.1997
8 pages
Aufsatz (Konferenz)
Englisch
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