Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Thermal analysis of an enclosed electronic device at flight and ground conditions
Thermal analysis of an enclosed electronic device at flight and ground conditions
Thermal analysis of an enclosed electronic device at flight and ground conditions
Schwarts, J. (Autor:in) / Keydar, S. (Autor:in) / Bar-Am, T. (Autor:in) / Association of Engineers and Architects in Israel
28th, Israel conference on mechanical engineering ; 2000 ; Beer-Sheva, Israel
01.01.2000
4 pages
Aufsatz (Konferenz)
Englisch
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