Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Investigation on the Deformation of Ground due to Shield Tunnelling in Sensitive Soft Clay
Investigation on the Deformation of Ground due to Shield Tunnelling in Sensitive Soft Clay
Investigation on the Deformation of Ground due to Shield Tunnelling in Sensitive Soft Clay
Nakahiro, T. (Autor:in) / Nakano, T. (Autor:in) / Natsukawa, K. (Autor:in) / Tateyama, K. (Autor:in) / Lee, C. F. / Hong Kong Politechnic University
3rd, International conference on soft soil engineering ; 2001 ; Hong Kong
01.01.2001
6 pages
Aufsatz (Konferenz)
Englisch
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