Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Thermal Expansion Compatibility of Repair Materials
Thermal Expansion Compatibility of Repair Materials
Thermal Expansion Compatibility of Repair Materials
Beran, P. (Autor:in) / Drdacky, M. (Autor:in) / Topping, B.H.V.
11th, International conference on civil, structural and environmental engineering computing ; 2007 ; St. Julians, Malta
01.01.2007
111 pages
Papers Held on CD-ROM
Aufsatz (Konferenz)
Englisch
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