Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Research Development in Void Formation Mechanism and Elimination Method during RTM Process
Research Development in Void Formation Mechanism and Elimination Method during RTM Process
Research Development in Void Formation Mechanism and Elimination Method during RTM Process
Yang, M. (Autor:in) / Zeng, Q.S. (Autor:in) / Wang, H.Y. (Autor:in) / Zhang, W.X. (Autor:in) / Li, L.
International Conference on Structures and Building Materials ; 2011 ; Guangzhou, China
01.01.2011
6 pages
Includes bibliographical references and index
Aufsatz (Konferenz)
Englisch
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