Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Ultrasonic Attenuation and Modulus Defect Associated with the Bordoni Peak in Copper Single Crystals
Ultrasonic Attenuation and Modulus Defect Associated with the Bordoni Peak in Copper Single Crystals
Ultrasonic Attenuation and Modulus Defect Associated with the Bordoni Peak in Copper Single Crystals
Moreno Gobbi, A. O. (Autor:in) / Eiras, J. A. (Autor:in) / Magalas, L. B. / Gorczyca, S.
01.01.1993
189 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
620.11
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