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Ceramic joining: Part I Partial transient liquid-phase bonding of alumina via Cu/Pt interlayers
Ceramic joining: Part I Partial transient liquid-phase bonding of alumina via Cu/Pt interlayers
Ceramic joining: Part I Partial transient liquid-phase bonding of alumina via Cu/Pt interlayers
Shalz, M. L. (Autor:in) / Dalgleish, B. J. (Autor:in) / Tomsia, A. P. (Autor:in) / Glaeser, A. M. (Autor:in)
JOURNAL OF MATERIALS SCIENCE ; 28 ; 1673
01.01.1993
1673 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
620.11
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