Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
The high-temperature creep behaviour of an Al-1 wt% Cu solid-solution alloy
The high-temperature creep behaviour of an Al-1 wt% Cu solid-solution alloy
The high-temperature creep behaviour of an Al-1 wt% Cu solid-solution alloy
Soliman, M. S. (Autor:in)
JOURNAL OF MATERIALS SCIENCE ; 28 ; 4483
01.01.1993
4483 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
620.11
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