Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Experimental Verification on Simulating Shrinkage and Warpage of Thin Compression Moulded SMC Parts
Experimental Verification on Simulating Shrinkage and Warpage of Thin Compression Moulded SMC Parts
Experimental Verification on Simulating Shrinkage and Warpage of Thin Compression Moulded SMC Parts
Osswald, T. A. (Autor:in) / Sun, E. M. (Autor:in) / Tseng, S.-C. (Autor:in)
POLYMERS AND POLYMER COMPOSITES ; 2 ; 187A
01.01.1994
187A
Aufsatz (Zeitschrift)
Unbekannt
DDC:
620.192
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