Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Simulation of Recrystallization Texture in Copper
Simulation of Recrystallization Texture in Copper
Simulation of Recrystallization Texture in Copper
Liu, Y. S. (Autor:in) / Wang, F. (Autor:in) / Xu, J. Z. (Autor:in) / Liang, Z. D. (Autor:in)
MATERIALS SCIENCE FORUM ; 1839
01.01.1994
1839 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
620.11
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