Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Thermal Bending Associated with Heat Conduction by Holographic Interferometry
Thermal Bending Associated with Heat Conduction by Holographic Interferometry
Thermal Bending Associated with Heat Conduction by Holographic Interferometry
Jou, C.-S. (Autor:in) / Farris, R. J. (Autor:in)
EXPERIMENTAL MECHANICS ; 34 ; 306
01.01.1994
306 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
620.1
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