Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Analysis of interfacial behavior in MMCs and IMCs by the use of thin-slice push-out tests
Analysis of interfacial behavior in MMCs and IMCs by the use of thin-slice push-out tests
Analysis of interfacial behavior in MMCs and IMCs by the use of thin-slice push-out tests
Chandra, N. (Autor:in) / Ananth, C. R. (Autor:in)
COMPOSITES SCIENCE AND TECHNOLOGY ; 54 ; 87
01.01.1995
87 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
620.118
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