Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Void behaviour due to internal pressure induced by temperature rise
Void behaviour due to internal pressure induced by temperature rise
Void behaviour due to internal pressure induced by temperature rise
Fan, X. J. (Autor:in) / Zhang, S. Y. (Autor:in)
JOURNAL OF MATERIALS SCIENCE ; 30 ; 3483
01.01.1995
3483 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
620.11
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