Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Grain Size Effect in High Temperature Creep and Superplastic Deformation of Polycrystalline Materials
Grain Size Effect in High Temperature Creep and Superplastic Deformation of Polycrystalline Materials
Grain Size Effect in High Temperature Creep and Superplastic Deformation of Polycrystalline Materials
Shi, L. (Autor:in) / Northwood, D. O. (Autor:in)
MATERIALS SCIENCE FORUM ; 335
01.01.1995
335 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
620.11
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