Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
The influence of certain factors on thickness loss after the hot gluing of cut lamellas into solid wood layered boards
The influence of certain factors on thickness loss after the hot gluing of cut lamellas into solid wood layered boards
The influence of certain factors on thickness loss after the hot gluing of cut lamellas into solid wood layered boards
Resnik, J. (Autor:in) / Sega, B. (Autor:in)
HOLZ ALS ROH UND WERKSTOFF ; 53 ; 327
01.01.1995
327 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
620.12
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