Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
On machining rate of hydrodynamic polishing process
On machining rate of hydrodynamic polishing process
On machining rate of hydrodynamic polishing process
Su, Y.-T. (Autor:in) / Wang, S.-Y. (Autor:in) / Hsiau, J.-S. (Autor:in)
WEAR -LAUSANNE- ; 188 ; 77
01.01.1995
77 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
620.11292
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