Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Back-stress distribution along a thin twin layer in TiAl
Back-stress distribution along a thin twin layer in TiAl
Back-stress distribution along a thin twin layer in TiAl
Jin, Z. (Autor:in) / Bieler, T. R. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING -LAUSANNE- A ; 192/193 ; 729-732
01.01.1995
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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