Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Rigid line inclusions under anti-plane deformation and in-plane electric field in piezoelectric materials
Shi, W. (Autor:in)
ENGINEERING FRACTURE MECHANICS ; 56 ; 265-274
01.01.1997
10 pages
Aufsatz (Zeitschrift)
Englisch
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