Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Thermal Stress Analysis of a PQFP Moulding Process: Comparison of Viscoelastic and Elastic Models
Thermal Stress Analysis of a PQFP Moulding Process: Comparison of Viscoelastic and Elastic Models
Thermal Stress Analysis of a PQFP Moulding Process: Comparison of Viscoelastic and Elastic Models
Park, J. H. (Autor:in) / Kim, J. K. (Autor:in) / Yuen, M. M. F. (Autor:in) / Lee, S. W. R. (Autor:in) / Tong, P. (Autor:in) / Chan, P. C. H. (Autor:in) / Tong, P. / Zhang, T. Y. / Kim, J. K.
01.01.1998
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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