Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Low temperature creep ductility of OFHC copper
Low temperature creep ductility of OFHC copper
Low temperature creep ductility of OFHC copper
Henderson, P. J. (Autor:in) / Sandstrom, R. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING -LAUSANNE- A ; 246 ; 145-152
01.01.1998
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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