Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Effect of grain size/texture on the cyclic stress-strain behavior of polycrystalline copper
Effect of grain size/texture on the cyclic stress-strain behavior of polycrystalline copper
Effect of grain size/texture on the cyclic stress-strain behavior of polycrystalline copper
Luoh, T. (Autor:in) / Chang, C. P. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING -LAUSANNE- A ; 256 ; 18-24
01.01.1998
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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