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Evaluation of Binder Burnout by Thermal Analysis
Evaluation of Binder Burnout by Thermal Analysis
Evaluation of Binder Burnout by Thermal Analysis
Rodrigues, D. (Autor:in) / Tschiptschin, A. P. (Autor:in)
MATERIALS SCIENCE FORUM ; 299/300 ; 439-447
01.01.1999
9 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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