Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Microstructural Evolution Associated with Creep Rate Minima in Pure- and Near-gamma TiAl Intermetallics
Microstructural Evolution Associated with Creep Rate Minima in Pure- and Near-gamma TiAl Intermetallics
Microstructural Evolution Associated with Creep Rate Minima in Pure- and Near-gamma TiAl Intermetallics
Dlouhy, A. (Autor:in) / Kucharova, K. (Autor:in) / Horkel, T. (Autor:in)
KEY ENGINEERING MATERIALS ; 693-700
01.01.2000
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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