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Strength and Fracture of Cu-Based Filamentary Nanocomposites
Strength and Fracture of Cu-Based Filamentary Nanocomposites
Strength and Fracture of Cu-Based Filamentary Nanocomposites
Hong, S. I. (Autor:in) / Chung, J. H. (Autor:in) / Kim, H. S. (Autor:in) / Hwang, W. / Han, K. S.
01.01.2000
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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