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A Damage-Coupled TMF Constitutive Model for Solder Alloy
A Damage-Coupled TMF Constitutive Model for Solder Alloy
A Damage-Coupled TMF Constitutive Model for Solder Alloy
Wei, Y. (Autor:in) / Chow, C. L. (Autor:in)
INTERNATIONAL JOURNAL OF DAMAGE MECHANICS ; 10 ; 133-152
01.01.2001
20 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.1
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