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Application of cure-accelerated phenol-formaldehyde (PF) adhesives for three-layer medium density fiberboard (MDF) manufacture
Application of cure-accelerated phenol-formaldehyde (PF) adhesives for three-layer medium density fiberboard (MDF) manufacture
Application of cure-accelerated phenol-formaldehyde (PF) adhesives for three-layer medium density fiberboard (MDF) manufacture
Park, B.-D. (Autor:in) / Riedl, B. (Autor:in) / Hsu, E. W. (Autor:in) / Shields, J. (Autor:in)
WOOD SCIENCE AND TECHNOLOGY -NEW YORK- ; 35 ; 311-324
01.01.2001
14 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.12
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