Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Electrochemical Behavior of Some Electroplates in Solutions for Coulometric Measurements of Their Thickness. III. Passivation Phenomena during the Dissolution of Copper Coatings
Electrochemical Behavior of Some Electroplates in Solutions for Coulometric Measurements of Their Thickness. III. Passivation Phenomena during the Dissolution of Copper Coatings
Electrochemical Behavior of Some Electroplates in Solutions for Coulometric Measurements of Their Thickness. III. Passivation Phenomena during the Dissolution of Copper Coatings
Vegis, Y. (Autor:in) / Simanavichyus, L. (Autor:in)
PROTECTION OF METALS -NEW YORK- C/C OF ZASHCHITA METALLOV ; 37 ; 586-591
01.01.2001
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
669
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