Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Traces of non-compact glide in the dislocation structure of copper after creep at high temperatures
Traces of non-compact glide in the dislocation structure of copper after creep at high temperatures
Traces of non-compact glide in the dislocation structure of copper after creep at high temperatures
Kvapilova, M. (Autor:in) / Orlova, A. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A -LAUSANNE- ; 328 ; 277 - 282
01.01.2002
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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