Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Properties of the passive films present on copper and copper-nickel alloys in slightly alkaline solutions
Properties of the passive films present on copper and copper-nickel alloys in slightly alkaline solutions
Properties of the passive films present on copper and copper-nickel alloys in slightly alkaline solutions
Cere, S. (Autor:in) / Vazquez, M. (Autor:in)
JOURNAL OF MATERIALS SCIENCE LETTERS ; 21 ; 493-495
01.01.2002
3 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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