Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Increase in Electrical Resistivity of Copper and Aluminum Fine Lines
Increase in Electrical Resistivity of Copper and Aluminum Fine Lines
Increase in Electrical Resistivity of Copper and Aluminum Fine Lines
Hanaoka, Y. (Autor:in) / Hinode, K. (Autor:in) / Takeda, K. (Autor:in) / Kodama, D. (Autor:in)
MATERIALS TRANSACTIONS ; 43 ; 1621-1623
01.01.2002
3 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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