Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Ag~3Sn plate formation in the solidification of near ternary eutectic Sn-Ag-Cu alloys
Ag~3Sn plate formation in the solidification of near ternary eutectic Sn-Ag-Cu alloys
Ag~3Sn plate formation in the solidification of near ternary eutectic Sn-Ag-Cu alloys
Henderson, D. W. (Autor:in) / Gosselin, T. (Autor:in) / Sarkhel, A. (Autor:in) / Kang, S. K. (Autor:in) / Choi, W.-K. (Autor:in) / Shih, D.-Y. (Autor:in) / Goldsmith, C. (Autor:in) / Puttlitz, K. J. (Autor:in)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 17 ; 2775-2778
01.01.2002
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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