Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Analysis of Process-Induced Residual Stresses in Tape Placement
Analysis of Process-Induced Residual Stresses in Tape Placement
Analysis of Process-Induced Residual Stresses in Tape Placement
Sonmez, F. O. (Autor:in) / Hahn, H. T. (Autor:in) / Akbulut, M. (Autor:in)
JOURNAL OF THERMOPLASTIC COMPOSITE MATERIALS ; 15 ; 525-544
01.01.2002
20 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.118
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