Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Critical Aspects of High-Performance Microprocessor Packaging
Critical Aspects of High-Performance Microprocessor Packaging
Critical Aspects of High-Performance Microprocessor Packaging
Atluri, V. P. (Autor:in) / Mahajan, R. V. (Autor:in) / Patel, P. R. (Autor:in) / Mallik, D. (Autor:in) / Tang, J. (Autor:in) / Wakharkar, V. S. (Autor:in) / Chrysler, G. M. (Autor:in) / Chiu, C.-P. (Autor:in) / Choksi, G. N. (Autor:in) / Viswanath, R. S. (Autor:in)
MRS BULLETIN- MATERIALS RESEARCH SOCIETY ; 28 ; 21-34
01.01.2003
14 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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