Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Emerging Materials Challenges in Microelectronics Packaging
Emerging Materials Challenges in Microelectronics Packaging
Emerging Materials Challenges in Microelectronics Packaging
Frear, D. R. (Autor:in) / Thomas, S. (Autor:in)
MRS BULLETIN- MATERIALS RESEARCH SOCIETY ; 28 ; 68-74
01.01.2003
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Microelectronics Packaging and Integration
| British Library Online Contents | 2003
Why Microelectronics and Packaging? Wireless Applications
| British Library Online Contents | 2001
Modeling Materials for Microelectronics - The Old and the New Challenges
| British Library Conference Proceedings | 1993
Nano and Giga Challenges in Microelectronics
British Library Online Contents | 2003
Materials science in microelectronics
British Library Online Contents | 2005