A modeling study on residual stress-induced interfacial debonding and stress-strain behavior of weakly bonded UD composites: Fid-Bau Portal

A modeling study on residual stress-induced interfacial debonding and stress-strain behavior of weakly bonded UD composites

Ochiai, S. / Tanaka, M. / Tanaka, H. / Kimura, S. / Hojo, M.

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A modeling study on residual stress-induced interfacial debonding and stress-strain behavior of weakly bonded UD composites

Ochiai, S. / Tanaka, M. / Tanaka, H. / Kimura, S. / Hojo, M.

A modeling study on residual stress-induced interfacial debonding and stress-strain behavior of weakly bonded UD composites

Ochiai, S. / Tanaka, M. / Tanaka, H. / Kimura, S. / Hojo, M.

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Titel:

A modeling study on residual stress-induced interfacial debonding and stress-strain behavior of weakly bonded UD composites

Beteiligte:

Ochiai, S. (Autor:in) / Tanaka, M. (Autor:in) / Tanaka, H. (Autor:in) / Kimura, S. (Autor:in) / Hojo, M. (Autor:in)

Erschienen in:

COMPOSITES PART A ; 33 ; 1337-1343

Erscheinungsdatum:

01.01.2002

Format / Umfang:

7 pages

ISSN:

1359-835X

Medientyp:

Aufsatz (Zeitschrift)

Format:

Sprache:

Englisch

Klassifikation:

DDC: 620.118

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