Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Spheres, springs, columns and beams Emerging technologies in bumped interconnections
Rinne, G. (Autor:in)
ADVANCED PACKAGING ; 10 ; 67-74
01.01.2001
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
658.564
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