Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
The back-end process: Step 7 Solder bumping - step by step
The back-end process: Step 7 Solder bumping - step by step
The back-end process: Step 7 Solder bumping - step by step
Patterson, D. S. (Autor:in)
ADVANCED PACKAGING ; 10 ; 75-80
01.01.2001
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
658.564
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The back-end process: Step 5 Encapsulation - step by step
| British Library Online Contents | 2001
The back-end process: Step 6 Lead forming - step by step
| British Library Online Contents | 2001
The back-end process: Step 4 Wire bonding - step by step
| British Library Online Contents | 2001
The back-end process: Step 2 Die placement - step by step
| British Library Online Contents | 2001
Lead-free Solder Wafer Bumping
| British Library Online Contents | 2004