Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Creep in copper dispersion strengthened with alumina particles (ODS copper)
Creep in copper dispersion strengthened with alumina particles (ODS copper)
Creep in copper dispersion strengthened with alumina particles (ODS copper)
Kucharova, K. (Autor:in) / Zhu, S. J. (Autor:in) / Cadek, J. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 348 ; 170-179
01.01.2003
10 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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