Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Thermal Stresses Around a Circular Hole in a Functionally Graded Plate
Thermal Stresses Around a Circular Hole in a Functionally Graded Plate
Thermal Stresses Around a Circular Hole in a Functionally Graded Plate
Zhang, X. Z. (Autor:in) / Kitipornchai, S. (Autor:in) / Liew, K. M. (Autor:in) / Lim, C. W. (Autor:in) / Peng, L. X. (Autor:in)
JOURNAL OF THERMAL STRESSES ; 26 ; 379-390
01.01.2003
12 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.1121
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