Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
On the Superposition of Heat Release Rate for Polymeric Materials
On the Superposition of Heat Release Rate for Polymeric Materials
On the Superposition of Heat Release Rate for Polymeric Materials
Chow, W. K. (Autor:in) / Yeung, H. W. A. (Autor:in)
ARCHITECTURAL SCIENCE REVIEW ; 46 ; 145-150
01.01.2003
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
720
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