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Effects of rolling and sintering temperature on peel strength of bonding interfaces for Ag/Cu bimetallic strips
Effects of rolling and sintering temperature on peel strength of bonding interfaces for Ag/Cu bimetallic strips
Effects of rolling and sintering temperature on peel strength of bonding interfaces for Ag/Cu bimetallic strips
Meng, L. (Autor:in) / Zhang, L. (Autor:in) / Zhou, S. P. (Autor:in) / Yang, F. T. (Autor:in)
MATERIALS SCIENCE AND TECHNOLOGY -LONDON- ; 19 ; 779-784
01.01.2003
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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