Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
A numerical study of the hygro-mechanical deformation of two cardboard layups
A numerical study of the hygro-mechanical deformation of two cardboard layups
A numerical study of the hygro-mechanical deformation of two cardboard layups
Gendron, G. (Autor:in) / Dano, M. L. (Autor:in) / Cloutier, A. (Autor:in)
COMPOSITES SCIENCE AND TECHNOLOGY ; 64 ; 619-627
01.01.2004
9 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.118
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