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Modeling spatial strain gradient effects in thermo-mechanical fatigue of copper microstructures
Modeling spatial strain gradient effects in thermo-mechanical fatigue of copper microstructures
Modeling spatial strain gradient effects in thermo-mechanical fatigue of copper microstructures
Pucha, R. V. (Autor:in) / Ramakrishna, G. (Autor:in) / Mahalingam, S. (Autor:in) / Sitaraman, S. K. (Autor:in)
INTERNATIONAL JOURNAL OF FATIGUE ; 26 ; 947-957
01.01.2004
11 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.1126
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