Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
The stress distribution around holes in thermal barrier coatings
The stress distribution around holes in thermal barrier coatings
The stress distribution around holes in thermal barrier coatings
Peng, X. (Autor:in) / Sridhar, N. (Autor:in) / Clarke, D. R. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A. ; 380 ; 208-214
01.01.2004
7 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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