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Interfacial microstructure and strength of partial transient liquid-phase bonding of silicon nitride with Ti/Ni multi-interlayer
Interfacial microstructure and strength of partial transient liquid-phase bonding of silicon nitride with Ti/Ni multi-interlayer
Interfacial microstructure and strength of partial transient liquid-phase bonding of silicon nitride with Ti/Ni multi-interlayer
Chen, Z. (Autor:in) / Cao, M. S. (Autor:in) / Zhao, Q. Z. (Autor:in) / Zou, J. S. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A. ; 380 ; 394-401
01.01.2004
8 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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