Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
The technique and machanism to fabricate lightweight Si-Al composites for electronic packaging
The technique and machanism to fabricate lightweight Si-Al composites for electronic packaging
The technique and machanism to fabricate lightweight Si-Al composites for electronic packaging
Yang, C. (Autor:in) / Ziqiao, Z. (Autor:in) / Shichen, L. (Autor:in)
PM TECHNOLOGY -CHINA-. ; 22 ; 168-172
01.01.2004
5 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
669
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