Numerical Analysis of Adhesive Thickness Effect on Fracture Toughness in Adhesive-Bonded Joints

Choi, J. Y. (Autor:in) / Kim, H. J. (Autor:in) / Lim, J. K. (Autor:in) / Mai, Y. W. (Autor:in) / Lee, S.-S. / Yoon, D.-J. / Lee, J.-H. / Lee, S.

Advances in Nondestructive Evaluation Part 2 Proceedings of the 11^t^h Asian Pacific Conference on Nondestructive Testing, Jeju Island, Korea, 3-7 November 2003 ; 1200-1205

KEY ENGINEERING MATERIALS

01.01.2004

6 pages

1013-9826

Aufsatz (Zeitschrift)

Print

Englisch

DDC:  620.11