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Aging effects on fracture behavior of 63Sn37Pb eutectic solder during tensile tests under the SEM
Aging effects on fracture behavior of 63Sn37Pb eutectic solder during tensile tests under the SEM
Aging effects on fracture behavior of 63Sn37Pb eutectic solder during tensile tests under the SEM
Ding, Y. (Autor:in) / Wang, C. (Autor:in) / Mingyu, L. (Autor:in) / Han-Sur, B. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 384 ; 314-323
01.01.2004
10 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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