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Influence of Process Conditions of Thixomolding® on the Microstructure of Magnesium Mobile Phone Housing
Influence of Process Conditions of Thixomolding® on the Microstructure of Magnesium Mobile Phone Housing
Influence of Process Conditions of Thixomolding® on the Microstructure of Magnesium Mobile Phone Housing
Cui, X. (Autor:in) / Liu, Y. (Autor:in) / Cao, Z. (Autor:in) / Yang, X. (Autor:in) / Liang, W. (Autor:in) / Ke, W. / Han, E. H. / Han, Y. F. / Kainer, K. / Luo, A. A.
01.01.2005
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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